Intel III 866 MHz 80526PZ866256 User Manual

Product codes

80526PZ866256

Datasheet

Pentium

III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz

NOTE: Capacitors will be placed on the pin-side of the FC-PGA package in the area defined by G1, G2, and

G3. This area is a keepout zone for motherboard designers.

For

Table 38

, the following apply:

1. It is not recommended to use any portion of the processor substrate as a mechanical reference

or load bearing surface for thermal solutions.

2. Parameters assume uniformly applied loads

NOTES:

1. Transient loading refers to a one time short duration loading, such as during heatsink installation.
2. Dynamic loading refers to a shock load.
3. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and

processor interface.

4. Please see socket manufacturer’s force loading specification also to ensure compliance. Maximum static

loading listed here does not account for the maximum reaction forces on the socket tabs or pins. Designs
must ensure that the socket can withstand this force.

Pin TP

0.508 Diametric True Position (Pin-to-Pin)

0.020 Diametric True Position (Pin-to-Pin)

Table 37. Package Dimensions for Intel

Pentium

III Processor FC-PGA2 Package

Symbol

Millimeters

Inches

Minimum

Maximum

Notes

Minimum

Maximum

Notes

Table 38. Processor Case Loading Parameters for FC-PGA2

Parameter

Transient

(max)

1, 4

Dynamic

(max)

2, 4

Static

(max)

3, 4

Unit

IHS Surface

200

100

lbf

IHS Edge

125

N/A

lbf

IHS Corner

N/A

lbf

Figure 25. FC-PGA2 Flatness Specification

Note: Flatness specifications in millimeters