Intel III Xeon 550 MHz 80525KY5501M User Manual

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6. Interface agent suggestions: ShinEtsu* G749 or Thermoset* TC330; Dispense volume adequate to ensure 

required minimum area of coverage when cooling solution is attached. Areas A and C are suggested for the 
512-Kbyte L2 cache product and areas A, B, and D for the 1-Mbyte and 2-Mbyte L2 cache products. 
Recommended cooling solution mating surface flatness is no greater than 0.007" or flatter. 

7. Temperature of the entire thermal plate surface not to exceed specification. Use any combination of interface 

agent, cooling solution, flatness condition, etc., to ensure this condition is met. Thermocouple measurement 
locations are the expected high temperature locations without external heat source influence. Ensure that 
external heat sources do not cause a violation of T

PLATE

 requirements

To ensure functional and reliable processor operation, the processor’s thermal plate temperature 
(T

PLATE

) must be maintained at or below the maximum T

PLATE

 and at or above the minimum 

T

PLATE

 specified in 

. Power from the processor core and L2 cache is transferred to the 

thermal plate at 2 locations on the 512-Kbyte L2 cache product and 3 locations on the 1-Mbyte and 

1.960

.980