Intel III Xeon 550 MHz 80525KY5501M User Manual
Product codes
80525KY5501M
Pentium
®
III Xeon™ Processor at 500 and 550 MHz
54
Datasheet
PLATE
measurement directly above
these transfer locations.
shows the 4 locations for T
COVER
measurement, directly above
component locations on the back side of the processor substrate.
Thermocouples are used to measure T
PLATE
and special care is required to ensure an accurate
temperature measurement. Before taking any temperature measurements, the thermocouples must
be calibrated. When measuring the temperature of a surface, errors can be introduced in the
measurement if not handled properly. Such measurement errors can be due to a poor thermal
contact between the thermocouple junction and the measured surface, conduction through
thermocouple leads, heat loss by radiation and convection, or by contact between the thermocouple
cement and the heatsink base. To minimize these errors, the following approach is recommended:
be calibrated. When measuring the temperature of a surface, errors can be introduced in the
measurement if not handled properly. Such measurement errors can be due to a poor thermal
contact between the thermocouple junction and the measured surface, conduction through
thermocouple leads, heat loss by radiation and convection, or by contact between the thermocouple
cement and the heatsink base. To minimize these errors, the following approach is recommended:
•
Use 36 gauge or finer diameter K, T, or J type thermocouples. Intel's laboratory testing was
done using a thermocouple made by Omega* (part number: 5TC-TTK-36-36).
done using a thermocouple made by Omega* (part number: 5TC-TTK-36-36).
•
Attach each thermocouple bead or junction to the top surface of the thermal plate at the
locations specified in
locations specified in
using high thermal conductivity cements.
•
A thermocouple should be attached at a 0° angle if no heatsink is attached to the thermal plate.
If a heatsink is attached to the thermal plate but the heatsink does not cover the location
specified for T
If a heatsink is attached to the thermal plate but the heatsink does not cover the location
specified for T
PLATE
measurement, the thermocouple should be attached at a 0° angle (refer to
•
The thermocouple should be attached at a 90° angle if a heatsink is attached to the thermal
plate and the heatsink covers the location specified for T
plate and the heatsink covers the location specified for T
PLATE
•
The hole size through the heatsink base to route the thermocouple wires out should be smaller
than 0.150" in diameter
than 0.150" in diameter
•
Make sure there is no contact between the thermocouple cement and heatsink base. This
contact will affect the thermocouple reading.
contact will affect the thermocouple reading.
5.2.3.2
Cover Temperature Measurement Guideline
The maximum and minimum S.E.C. cartridge cover temperature (T
COVER
) for Pentium
III
Xeon
. Meeting this temperature specification is required to ensure
correct and reliable operation of the processor. In the design of a system, other sources of heat
convection, conduction or radiation should be evaluated for any possible effect on the cartridge
cover temperature. In a system free from such external sources of heat, the higher temperature
convection, conduction or radiation should be evaluated for any possible effect on the cartridge
cover temperature. In a system free from such external sources of heat, the higher temperature
Figure 21.
Technique for Measuring T
PLATE
with 0° Angle Attachment
Figure 22.
Technique for Measuring T
PLATE
with 90° Angle Attachment