Intel III 450 MHz 80525PY450512 Data Sheet

Product codes
80525PY450512
Page of 101
46
 
Datasheet
Signal Quality Specifications
3.3
AGTL+ and Non-AGTL+ Ringback Specifications and 
Measurement Guidelines
Ringback refers to the amount of reflection seen after a signal has switched. The ringback 
specification is the voltage that the signal rings back to after achieving its maximum absolute 
value
. (See 
 for an illustration of ringback.) Excessive ringback can cause false signal 
detection or extend the propagation delay. The ringback specification applies to the input pin of 
each receiving agent. Violations of the signal ringback specification are not allowed under any 
circumstances for both AGTL+ and non-AGTL+ signals.
When performing simulations to determine the impact of ringback, ESD diodes must be properly 
characterized. The Intel provided Pentium III Processor I/O Buffer Models contain I/O capacitance 
characterization. Therefore, removing the ESD diodes from the I/O buffer model will impact 
results and may yield incorrect ringback. If other I/O buffer models are being used to characterize 
Pentium III processor performance, care must be taken to ensure that ESD models account for the 
I/O capacitance. See 
 for the signal ringback specifications for both AGTL+ and 
non-AGTL+ signals for simulations at the processor core.
Figure 15. Maximum Acceptable AGTL+ and Non-AGTL+ Overshoot/Undershoot Waveform
Vss
Undershoot
Magnitude
=   V
TT
 - Signal
Overshoot
Magnitude
=   Signal - Vss
V
TT
2.3V
2.2V
2.1V
2.0V
1.635V
Max
Overshoot
Magnitude
Time Dependent
Overshoot
Converted Undershoot
Waveform
Undershoot
Magnitude
Time Dependent
Undershoot