Intel III 450 MHz 80525PY450512 Data Sheet
Product codes
80525PY450512
Datasheet
67
S.E.C.C. and S.E.C.C.2 Mechanical Specifications
5.3
S.E.C.C.2 Structural Mechanical Specification
The intention of the structural specification for S.E.C.C.2 is to ensure that the package will not be
exposed to excessive stresses that could adversely affect device reliability.
exposed to excessive stresses that could adversely affect device reliability.
illustrates the
deflection specification for deflections away from the heatsink.
illustrates the deflection
specification in the direction of the heatsink.
The heatsink attach solution must not induce permanent stress into the S.E.C.C.2 substrate with the
exception of a uniform load to maintain the heatsink to the processor thermal interface.
exception of a uniform load to maintain the heatsink to the processor thermal interface.
and
define the pressure specification.
Figure 44. Intel
®
Pentium
®
III Processor Markings (S.E.C.C.2 Package)
Table 30. Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)
Code Letter
Description
A
Logo
C
Trademark
D
Logo
F
Dynamic Mark Area – with 2-D matrix
NOTE:
Please refer to the Pentium
Please refer to the Pentium
®
III
Processor Specification Update
for this information.
for this information.
D
F
"""" " """ "" "
""""" " " " "
""" " " " """"
"""" "" """ ""
" " " " "" " " "
"""" " " " " ""
""" " "" """ " "
"" "" " "" " ""
" " " """"" ""
" " " "" "
Figure 45. Substrate Deflection away from Heatsink
F/2
F/2
5 cycles maximum
0.025
Processor Substrate