Intel III 450 MHz 80525PY450512 Data Sheet

Product codes

80525PY450512

Datasheet

S.E.C.C. and S.E.C.C.2 Mechanical Specifications

5.4

Processor Package Materials Information

Both the S.E.C.C. and S.E.C.C.2 processor packages are comprised of multiple pieces to make the
complete assembly. This section provides the weight of each piece and the entire package.

Table 32

and

Table 33

contain piece-part information of the S.E.C.C. and S.E.C.C.2 processor packages,

respectively.

5.5

Intel

Pentium

III Processor Signal Listing

Table 34

and

Table 35

provide the processor edge finger signal definitions. The signal locations on

the SC242 edge connector are to be used for signal routing, simulation, and component placement
on the baseboard.

Table 34

is the Pentium III processor substrate edge finger listing in order by pin number.

Table 35

is the Pentium III processor substrate edge connector listing in order by signal name.

Table 32. S.E.C.C. Materials

S.E.C.C. Piece

Piece Material

Maximum Piece Weight (Grams)

Extended Thermal Plate

Aluminum 6063-T6

84.0

Latch Arms

GE Lexan 940-V0, 30% glass filled

Less than 2.0 per latch arm

Cover

GE Lexan 940-V0

24.0

Total Pentium III Processor

112.0

Table 33. S.E.C.C.2 Materials

S.E.C.C.2 Piece

Piece Material

Maximum Piece Weight (Grams)

Cover

GE Lexan 940-V0

18.0

Total Pentium III Processor

54.0