Intel III 450 MHz 80525PY450512 Data Sheet

Intel

Product codes

80525PY450512

Datasheet

7

System Bus AC Specifications (TAP Connection) at the Processor
Core Pins............................................................................................................. 36

BCLK, PICCLK, and PWRGOOD Signal Quality Specifications at the
Processor Core ................................................................................................... 40

100 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance ..................... 44

133 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance ..................... 45

33 MHz Non-AGTL+ Signal Group Overshoot/Undershoot Tolerance................ 45

Signal Ringback Specifications for Signal Simulation ......................................... 47

AGTL+ and Non-AGTL+ Signal Groups Ringback Tolerance Specifications...... 47

Thermal Specifications for S.E.C.C. Packaged Processors................................ 50

Thermal Specifications for S.E.C.C.2 Packaged Processors.............................. 51

Thermal Diode Parameters ................................................................................. 53

Thermal Diode Interface...................................................................................... 53

Description Table for Processor Markings (S.E.C.C. Packaged Processor)....... 61

Description Table for Processor Markings (S.E.C.C.2 Packaged Processor) .....67

S.E.C.C.2 Pressure Specifications...................................................................... 68

S.E.C.C. Materials...............................................................................................69

S.E.C.C.2 Materials............................................................................................. 69

Signal Listing in Order by Pin Number ................................................................ 70

Signal Listing in Order by Signal Name...............................................................73

Via Listing in Order by Signal Name ................................................................... 77

Via Listing in Order by VIA Location.................................................................... 82

Intel

®

Boxed Processor Fan Heatsink Spatial Dimensions ................................. 90

Fan Heatsink Power and Signal Specifications................................................... 91

Baseboard Fan Power Connector Location ........................................................ 92

Signal Description ...............................................................................................93

Output Signals................................................................................................... 100

Input Signals...................................................................................................... 100

Input/Output Signals (Single Driver).................................................................. 101

Input/Output Signals (Multiple Driver) ............................................................... 101