Intel III 450 MHz 80525PY450512 Data Sheet
Product codes
80525PY450512
Datasheet
9
Introduction
1.0
Introduction
The Intel
®
Pentium
®
III processor is the next member of the P6 family, in the Intel
®
IA-32
processor line. Like the Intel
®
Pentium
®
II processor, the Pentium III processor implements the
Dynamic Execution microarchitecture - a unique combination of multiple branch prediction, data
flow analysis, and speculative execution. This enables these processors to deliver higher
performance than the Pentium processor, while maintaining binary compatibility with all previous
Intel Architecture processors. The Pentium III processor also executes Intel
flow analysis, and speculative execution. This enables these processors to deliver higher
performance than the Pentium processor, while maintaining binary compatibility with all previous
Intel Architecture processors. The Pentium III processor also executes Intel
®
MMX™ technology
instructions for enhanced media and communication performance just as it’s predecessor, the
Pentium II processor. The Pentium III processor executes Internet Streaming SIMD Extensions for
enhanced floating point and 3-D application performance. In addition, the Pentium III processor
extends the concept of processor identification with the addition of a processor serial number.
Refer to the Intel
Pentium II processor. The Pentium III processor executes Internet Streaming SIMD Extensions for
enhanced floating point and 3-D application performance. In addition, the Pentium III processor
extends the concept of processor identification with the addition of a processor serial number.
Refer to the Intel
®
Processor Serial Number application note (Document Number
245125
) for
more detailed information. The Pentium III processor utilizes multiple low-power states such as
AutoHALT, Stop-Grant, Sleep, and Deep Sleep to conserve power during idle times.
AutoHALT, Stop-Grant, Sleep, and Deep Sleep to conserve power during idle times.
The Pentium III processor utilizes the same multiprocessing system bus technology as the
Pentium II processor. This allows for a higher level of performance for both uni-processor and two-
way multiprocessor (2-way MP) systems. See the Intel
Pentium II processor. This allows for a higher level of performance for both uni-processor and two-
way multiprocessor (2-way MP) systems. See the Intel
®
Pentium
®
III Processor Specification
Update (Document Number 244453) for guidelines on which processors can be mixed in an MP
system. Memory is cacheable for 4 GB of addressable memory space, allowing significant
headroom for desktop systems.
system. Memory is cacheable for 4 GB of addressable memory space, allowing significant
headroom for desktop systems.
The Pentium III processor is available with two different second level (L2) cache implementations.
The “Discrete” cache version (CPUID=067xh) uses commercially available parts for the L2 cache.
The L2 cache is composed of an external (to processor silicon) TagRAM and burst pipelined
synchronous static RAM (BSRAM), as seen in
The “Discrete” cache version (CPUID=067xh) uses commercially available parts for the L2 cache.
The L2 cache is composed of an external (to processor silicon) TagRAM and burst pipelined
synchronous static RAM (BSRAM), as seen in
. The “Advanced Transfer Cache”
(CPUID=068xh) does not use commercially available L2 cache parts. Its L2 cache resides entirely
within the processor silicon, as seen in
within the processor silicon, as seen in
. Refer to
to determine the L2 cache
implementation for each Pentium III processor.
Pentium III processors are offered in either Single Edge Contact Cartridge (S.E.C.C.) or Single
Edge Contact Cartridge 2 (S.E.C.C.2) package technologies. The S.E.C.C. package has the
following features: an extended thermal plate, a cover, and a substrate with an edge finger
connection. The extended thermal plate allows heatsink attachment or customized thermal
solutions. The S.E.C.C.2 package has a cover and a substrate with an edge finger connection. This
allows the thermal solutions to be placed directly onto the processor core package. The edge finger
connection maintains socketability for system configuration. The edge finger connector is called
the ‘SC242 connector’ in this and other documentation.
Edge Contact Cartridge 2 (S.E.C.C.2) package technologies. The S.E.C.C. package has the
following features: an extended thermal plate, a cover, and a substrate with an edge finger
connection. The extended thermal plate allows heatsink attachment or customized thermal
solutions. The S.E.C.C.2 package has a cover and a substrate with an edge finger connection. This
allows the thermal solutions to be placed directly onto the processor core package. The edge finger
connection maintains socketability for system configuration. The edge finger connector is called
the ‘SC242 connector’ in this and other documentation.
Figure 1. Second Level (L2) Cache Implementation
Processor
Core
Tag
L2
Processor
Core
L2
Discrete Cache
Advanced Transfer Cache