Intel III 450 MHz 80525PY450512 Data Sheet

90

The boxed processor fan heatsink will not weigh more than 225 grams. See 

 and 

 for details on the processor weight and heatsink requirements.

The boxed processor requires processor retention mechanism(s) to secure the processor in the 
242-contact slot connector. S.E.C.C.2 processors must use either retention mechanisms described 
in AP-826, Mechanical Assembly and Customer Manufacturing Technology for S.E.P. Packages 
(Document Number 243748) or Universal Retention Mechanisms that accept S.E.C.C., S.E.P.P. 
and S.E.C.C.2 packaged processors. The boxed processor will not ship with a retention 
mechanism. Baseboards designed for use by system integrators must include retention 
mechanisms that support the S.E.C.C.2 package and the appropriate installation instructions.

A

S.E.C.C.2 Fan Heatsink Depth (off processor 
substrate)

1.48

B

S.E.C.C.2 Fan Heatsink Height Above Baseboard

0.4

C

S.E.C.C.2 Fan Heatsink Height

2.2

D

S.E.C.C.2 Fan Heatsink Width (plastic shroud only)

4.9

E

S.E.C.C.2 Power Cable Connector Location from 
Edge of Fan Heatsink Shroud

1.4

1.45

F

Airflow keep-out zones from end of fan heatsink

0.40

G

Airflow keep-out zones from face of fan heatsink

0.20