Intel III 450 MHz 80525PY450512 Data Sheet

92

This section describes the cooling requirements of the fan heatsink solution utilized by the boxed 
processor.

The boxed processor will be directly cooled with a fan heatsink. However, meeting the processor's 
temperature specification is also a function of the thermal design of the entire system, and 
ultimately the responsibility of the system integrator. Refer to 

 for processor 

temperature specifications. The boxed processor fan heatsink is able to keep the processor 
temperature within the specifications (see 

) in chassis that provide good 

thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the 
airflow provided to the fan heatsink is unimpeded. Airspace is required around the fan to ensure 
that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink 
reduces the cooling efficiency and decreases fan life. 

 illustrates an acceptable airspace 

clearance for the fan heatsink. It is also recommended that the air temperature entering the fan be 
kept below 45 °C (see 

 for measurement location). Again, meeting the processor's 

temperature specification is the responsibility of the system integrator. Refer to 

 for 

processor temperature specifications.

 

V

Approximate perpendicular distance of the fan power connector 
from the center of the 242-contact slot connector

1.44

W

Approximate parallel distance of the fan power connector from 
the edge of the 242-contact slot connector

1.45

X

Lateral distance of the baseboard fan power header location 
from the fan power connector

4.75

242-Contact Slot Connector

W

V

Fan power connector location
(1.56 inches above motherboard

Motherboard fan power header should be
positioned within 4.75 inches of the fan
power connector (lateral distance).

X