Intel S2600JFQ BBS2600JFQ User Manual
Product codes
BBS2600JFQ
Platform Management Functional Overview
Intel®
Server Board S2600JF TPS
Revision 1.3
Intel order number G31608-004
32
Intel
®
i350 NIC will have an integrated digital thermal sensor accessible through CSR and
manageability registers.
The thermal sensor can be programmed to trigger digital pins and
thermal throttling with hysteresis.
3.5 InfiniBand* Controller
Intel
®
Server Board S2600JFQ and JF2600JFF are populated with a new generation InfiniBand*
adapter device. Mellanox* ConnectX-3* supports Virtual Protocol Interconnect
®
(VPI), providing
single port 10/20/40 Gb/s InfiniBand* interfaces. The functional diagram is as follows:
Figure 16. ConnectX
®
-3 function block diagram
Major features and functions include
Single InfiniBand* Port: SDR/DDR/QDR/FDR with port remapping in firmware
Performance optimization: achieving single port line-rate bandwidth
PCI Express 3.0* x8 to achieve 2.5, 5 or 8GT/s link rate
Optimized for LOM: Small footprint, minimal peripherals, WOL, integrated sensors
Performance optimization: achieving single port line-rate bandwidth
PCI Express 3.0* x8 to achieve 2.5, 5 or 8GT/s link rate
Optimized for LOM: Small footprint, minimal peripherals, WOL, integrated sensors
and BMC interface
Low power consumption: 6.5 Watt typical
3.5.1
Device Interfaces
Following is a list of major interfaces of Mellanox* ConnectX-3* chip:
Clock and Reset signals: include core clock input and chip reset signals
Uplink Bus: The PCI Express* bus is a high-speed uplink interface used to connect
Uplink Bus: The PCI Express* bus is a high-speed uplink interface used to connect
ConnectX-3* to the host processor. The ConnectX-3* supports a PCI Express 3.0*
x8 uplink connection with transfer rates of 2.5GT/s, 5GT/s, and 8GT/s per lane.
x8 uplink connection with transfer rates of 2.5GT/s, 5GT/s, and 8GT/s per lane.