Intel III Xeon 733 MHz 80526KZ733256 User Manual

Product codes
80526KZ733256
Page of 105
 
MECHANICAL SPECIFICATIONS 
 
 
60 
7. MECHANICAL SPECIFICATIONS 
 
The processor use S.E.C. cartridge package technology. The S.E.C. cartridge contains the processor core, 
OCVR and other components. The S.E.C. cartridge package connects to the baseboard through an edge 
connector. Mechanical specifications for the processor are given in this section. See Section 1.1.1 for a 
complete terminology listing. 
 
Figure 22 shows the thermal plate side view and the cover side view of the processor. Figure 23 shows the 
S.E.C. cartridge cooling solution attachment feature details on the thermal plate and depict package form 
factor dimensions and retention enabling features of the S.E.C. cartridge. The processor edge connector 
defined in this document is referred to as "SC330.1". This connector definition is mechanically the same as 
the existing SC 300 (formerly Slot 2). See the SC330 connector specifications for further details on the edge 
connector. 
 
Table 50 and Table 51 provide the edge finger and SC330.1 connector signal definitions for processor. The 
signal locations on the SC330 edge connector are to be used for signal routing, simulation and component 
placement on the baseboard. 
 
 
me001.wmf 
Figure 22. Isometric View of S.E.C. Cartridge 
NOTES:
  Use of retention holes and retention indents are optional. 
11.  For SC330 connector specifications, see the SC330 Connector Specification
12.  All dimensions in inches for figures 23 thru 28.