Intel i5-3210M AW8063801032301 User Manual

Product codes
AW8063801032301
Page of 168
Datasheet, Volume 1
103
Electrical Specifications 
3.
The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE pins at the 
socket with a 100-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-MΩ minimum 
impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external 
noise from the system is not coupled into the oscilloscope probe.
4.
PSx refers to the voltage regulator power state as set by the SVID protocol. 
5.
Each processor is programmed with a maximum valid voltage identification value (VID), which is set at 
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing 
such that two processors at the same frequency may have different settings within the VID range. This 
differs from the VID employed by the processor during a power or thermal management event (Intel 
Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).
Table 7-11. DDR3/DDR3L/DDR3L-RS Signal Group DC Specifications  (Sheet 1 of 2)
Symbol
Parameter
Min
Typ
Max
Units
Notes
1
V
IL
Input Low Voltage
SM_VREF -0.1
V
2, 4, 11
V
IH
Input High Voltage
SM_VREF + 
0.1
V
3,  11
V
IL
Input Low Voltage 
(SM_DRAMPWROK)
V
DDQ
*0.55 -0.1
V
10
V
IH
Input High Voltage 
(SM_DRAMPWROK)
V
DDQ
*0.55 
+0.1
V
10
V
OL
Output Low Voltage
(V
DDQ
 / 2)* (R
ON 
/(R
ON
+R
TERM
))
6
V
OH
Output High 
Voltage
V
DDQ
 - ((V
DDQ
 / 2)* 
(R
ON
/(R
ON
+R
TERM
))
V
4,  6
R
ON_UP(DQ)
DDR3 Data Buffer 
pull-up Resistance
20
28.6
40
Ω
5
R
ON_DN(DQ)
DDR3 Data Buffer 
pull-down 
Resistance
20
28.6
40
Ω
5
R
ODT(DQ)
DDR3 On-die 
termination 
equivalent 
resistance for data 
signals
40
50
60
Ω
V
ODT(DC)
DDR3 On-die 
termination DC 
working point 
(driver set to 
receive mode)
0.4*V
DDQ
0.5*V
DDQ
0.6*V
DDQ
V
R
ON_UP(CK)
DDR3 Clock Buffer 
pull-up Resistance
20
26
40
Ω
5, 12
R
ON_DN(CK)
DDR3 Clock Buffer 
pull-down 
Resistance
20
26
40
Ω
5, 12
R
ON_UP(CMD)
DDR3 Command 
Buffer pull-up 
Resistance
15
20
25
Ω
5, 12
R
ON_DN(CMD)
DDR3 Command 
Buffer pull-down 
Resistance
15
20
25
Ω
5, 12
R
ON_UP(CTL)
DDR3 Control 
Buffer pull-up 
Resistance
15
20
25
Ω
5, 12
R
ON_DN(CTL)
DDR3 Control 
Buffer pull-down 
Resistance
15
20
25
Ω
5, 12