Intel G870 CM8062307260115 User Manual

Datasheet, Volume 1

73

Due to the voltage levels supported by other components in the Test Access Port (TAP) 
logic, Intel recommends the processor be first in the TAP chain, followed by any other 
components within the system. A translation buffer should be used to connect to the 
rest of the chain unless one of the other components is capable of accepting an input of 
the appropriate voltage. Two copies of each signal may be required with each driving a 
different voltage level. 

 specifies absolute maximum and minimum ratings. At conditions outside 

functional operation condition limits, but within absolute maximum and minimum 
ratings, neither functionality nor long-term reliability can be expected. If a device is 
returned to conditions within functional operation limits after having been subjected to 
conditions outside these limits (but within the absolute maximum and minimum 
ratings) the device may be functional, but with its lifetime degraded depending on 
exposure to conditions exceeding the functional operation condition limits.

At conditions exceeding absolute maximum and minimum ratings, neither functionality 
nor long-term reliability can be expected. Moreover, if a device is subjected to these 
conditions for any length of time, it will either not function or its reliability will be 
severely degraded when returned to conditions within the functional operating 
condition limits.

Although the processor contains protective circuitry to resist damage from Electro-
Static Discharge (ESD), precautions should always be taken to avoid high static 
voltages or electric fields.

1.

For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must 

be satisfied.

2.

Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.

3.

Storage temperature is applicable to storage conditions only. In this scenario, the processor must not 

receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect 

the long-term reliability of the device. For functional operation, refer to the processor case temperature 

specifications.

4.

This rating applies to the processor and does not include any tray or packaging.

5.

Failure to adhere to this specification can affect the long-term reliability of the processor.

6.

V

CC 

is a VID based rail.

7.

V

AXG

 is a VID based rail.

V

CC

Processor Core voltage with respect 

to V

SS

-0.3

1.40

V

6

V

TT

Voltage for the memory controller 

and Shared Cache with respect to V

SS

-0.3

1.40

V

V

DDQ

Processor I/O supply voltage for 

DDR3 with respect to V

SS

-0.3

1.80

V

V

CCPLL

Processor PLL voltage with respect to 

V

SS

-0.3

1.98

V

V

AXG

Graphics voltage with respect to V

SS

-0.3

1.55

V

7

T

STORAGE

Storage temperature

-40

85

C

3,  4,  5