NEC Intel Xeon E5-2430 N8101-563F User Manual

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

243

Datasheet Volume One

Intel boxed processors are intended for system integrators who build systems from 
components available through distribution channels. The Intel® Xeon® processor E5-

2600 product family (LGA2011-0 land FCLGA10) processors will be offered as Intel 

boxed processors, however the thermal solutions will be sold separately. 

Boxed processors will not include a thermal solution in the box. Intel will offer boxed 

thermal solutions separately through the same distribution channels. Please reference 

 for a description of Boxed Processor thermal solutions.

Intel will offer three different Boxed Heat Sink solutions to support LGA2011-0 land 

FCLGA10 Boxed Processors

• Boxed Intel® Thermal Solution STS200C (Order Code BXSTS200C): A Passive / 

Active Combination Heat Sink Solution that is intended for processors with a TDP 

up to 150W in a pedestal or 130W in 2U+ chassis with appropriate ducting.

• Boxed Intel® Thermal Solution STS200P (Order Code BXSTS200P): A 25.5 mm Tall 

Passive Heat Sink Solution that is intended for processors with a TDP of 130W or 
lower in 1U, or 2U chassis with appropriate ducting. Check with Blade manufacturer 

for compatibility.

• Boxed Intel® Thermal Solution STS200PNRW (Order Code BXSTS200PNRW): A 

25.5 mm Tall Passive Heat Sink Solution that is intended for processors with a TDP 

of 130W or lower in 1U, or 2U chassis with appropriate ducting. Compatible with 
the narrow processor integrated load mechanism. Check with Blade manufacturer 

for compatibility.

The STS200C, based on a 2U passive heat sink with a removable fan, is intended for 

use with processors with TDP’s up to 150W in active configuration and 130W in passive 
configuration. This heat pipe-based solution is intended to be used as either a passive 

heat sink in a 2U or larger chassis, or as an active heat sink for pedestal chassis. 

 are representations of the heat sink solution. Although the 

active combination solution with the removable fan installed mechanically fits into a 2U 

keepout, its use has not been validated in that configuration.

The STS200C in the active fan configuration is primarily designed to be used in a 
pedestal chassis where sufficient air inlet space is present. The STS200C with the fan 

removed, as with any passive thermal solution, will require the use of chassis ducting 

and are targeted for use in rack mount or ducted pedestal servers. The retention 
solution used for these products is called ILM Retention System (ILM-RS).