NEC Intel Xeon E5-2430 N8101-563F User Manual

Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families

245

Datasheet Volume One

sink solutions. The retention solution used for the STS200P Heat Sink Solution is called 

the ILM Retention System (ILM-RS).The retention solution used for the STS200PNRW 
Narrow Heat Sink Solution is called the Narrow ILM Retention System (Narrow ILM-RS).

This section documents the mechanical specifications of the boxed processor solution. 

The boxed processor and boxed thermal solutions will be sold separately. Clearance is 
required around the thermal solution to ensure unimpeded airflow for proper cooling. 

Baseboard keepout zones are 

 - 

. Physical space requirements 

and dimensions for the boxed processor and assembled heat sink are shown in 

. Mechanical drawings for the 4-pin fan header and 4-pin 

connector used for the active fan heat sink solution are represented in 

and 

.

None of the heat sink solutions exceed a mass of 550 grams. Note that this is per 

processor, a dual processor system will have up to 1100 grams total mass in the heat 

sinks. See 

 for details on the processor mass test.