AMD Opteron 1216 2.4GHz OSA1216CSBOX Product Datasheet

Product codes
OSA1216CSBOX
Page of 4
Advanced Micro Devices 
AMD Opteron™Processor
Product Data Sheet
Compatible with Existing 32-Bit Code Base
Including support for SSE, SSE2, SSE3*, MMX™, 
3DNow!™ technology and legacy x86 instructions 
*SSE3 supported by Rev E and later
Runs existing operating systems and drivers
Local APIC on the chip
AMD64 Technology
AMD64 technology instruction set extensions
64-bit integer registers, 48-bit virtual addresses, 
40-bit physical addresses
Eight additional 64-bit integer registers (16 total)
Eight additional 128-bit SSE/SSE2/SSE3 registers 
(16 total)
Multi-Core Architecture
Single-core or dual-core options
Discrete L1 and L2 cache structures for each core
64-Kbyte 2-Way Associative ECC-Protected 
L1 Data Cache
Two 64-bit operations per cycle, 3-cycle latency
64-Kbyte 2-Way Associative Parity-Protected 
L1 Instruction Cache
With advanced branch prediction
1024-Kbyte (1-Mbyte) 16-Way Associative 
ECC-Protected L2 Cache
Exclusive cache architecture—storage in addition 
to L1 caches
Up to 1 Mbyte per L2 cache
Machine Check Architecture
Includes hardware scrubbing of major 
ECC-protected arrays
Power Management
Multiple low-power states
System Management Mode (SMM)
ACPI compliant, including support for processor 
performance states
940-Pin Package Specific Features
Refer to the AMD Functional Data Sheet, 
940-Pin Package
, order# 31412, for functional, 
electrical, and mechanical details of 940-pin 
processors.
Electrical Interfaces
HyperTransport™ technology: LVDS-Like 
differential, unidirectional
DDR SDRAM: SSTL_2 per JEDEC specification
Clock, reset, and test signals also use DDR 
SDRAM-like electrical specifications
Packaging
940-pin lidded ceramic or organic micro PGA
1.27-mm pin pitch
31 x 31 row pin array
40 mm x 40 mm ceramic or organic substrate
Ceramic or organic C4 die attach
Integrated Memory Controller
Low-latency, high-bandwidth
144-bit DDR SDRAM at 100, 133, 166, and 200 
MHz (200 MHz supported by Rev C0 and later)
Supports up to eight registered DIMMs
ECC checking with double-bit detect and single-bit 
correct
HyperTransport™ Technology to I/O Devices
Three links, 16-bits in each direction, each supports 
up to 2000 MT/s or 4.0 GB/s in each direction 
(2000MT/s supported by Rev E and later)
Each link on uniprocessor (UP) models supports 
connections to I/O devices.
Each link on dual-processor (DP) models supports 
connections to I/O devices, and any one of the three 
available links may connect to another DP or MP 
processor.
Each link on multiprocessor (MP) models supports 
connections to I/O devices or other DP or MP 
processors.
23932
Publication #
3.19
Revision:
September 2006
Issue Date: