Supermicro Xeon P4X4-028-512K User Manual

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The Intel® Xeon™ Processor with 533 MHz Front Side Bus uses the Flip Chip Micro-Pin Grid
Array (FC-mPGA) package containing the processor die covered by an integrated heat spreader

(IHS)  Mechanical specifications for the processor are given in this section. See 

 for

terminology definitions. 

 provides a basic assembly drawing and includes the components

which make up the entire processor. Package dimensions are provided in 

The Intel® Xeon™ processor with 533 MHz Front Side Bus utilizes a surface mount 604-pin zero-

insertion force (ZIF) socket for installation into the baseboard. See the 604-Pin Socket Design

Guidelines for further details on the processor socket.

For 

 through 

, the following notes apply:

1. Unless otherwise specified, the following drawings are dimensioned in millimeters.

2. All dimensions are not tested, but are guaranteed by design characterization.

3. Figures and drawings labelled as “Reference Dimensions” are provided for informational

purposes only. Reference Dimensions are extracted from the mechanical design database and

are nominal dimensions with no tolerance information applied. Reference Dimensions are

NOT checked as part of the processor manufacturing process. Unless noted as such,
dimensions in parentheses without tolerances are Reference Dimensions.

4. Drawings are not to scale.

applies to Intel Xeon processor in the FC-mPGA2 package. 

1. Integrated Heat Spreader (IHS)

2. Processor die

3. FC-mPGA2 package

4. Land side Capacitors
5. Package Pin

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