NEC Intel Xeon E5-2430 N8101-572F User Manual

Product codes
N8101-572F
Page of 258
Boxed Processor Specifications
254
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
10.2.2
Boxed Processor Retention Mechanism and Heat Sink 
Support (ILM-RS)
Baseboards designed for use by a system integrator should include holes that are in 
proper alignment with each other to support the boxed processor.
The standard and narrow ILM-RSs are designed to extend air-cooling capability through 
the use of larger heat sinks with minimal airflow blockage and bypass. ILM-RS 
retention transfers load to the baseboard via the ILM Assembly. The ILM-RS spring, 
captive in the heatsink, provides the necessary compressive load for the thermal 
interface material. For specific design details on the standard and narrow ILM-RS and 
the Backplate please refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 
Product Families Thermal/Mechanical Design Guide
.
All components of the ILM-RS heat sink solution will be captive to the heat sink and will 
only require a Phillips screwdriver to attach to the ILM Backplate Assembly. When 
installing the ILM-RS the screws should be tightened until they will no longer turn 
easily. This should represent approximately 8 inch-pounds of torque. More than that 
may damage the retention mechanism components.
10.3
Fan Power Supply [STS200C] 
The 4-pin PWM controlled thermal solution is being offered to help provide better 
control over pedestal chassis acoustics. This is achieved through more accurate 
measurement of processor die temperature through the processor’s Digital Thermal 
Sensors. Fan RPM is modulated through the use of an ASIC located on the baseboard 
that sends out a PWM control signal to the 4th pin of the connector labeled as Control. 
This thermal solution requires a constant +12 V supplied to pin 2 of the active thermal 
solution and does not support variable voltage control or 3-pin PWM control. See 
 for details on the 4-pin active heat sink solution 
connectors. 
The fan power header on the baseboard must be positioned to allow the fan heat sink 
power cable to reach it. The fan power header identification and location must be 
documented in the suppliers platform documentation, or on the baseboard itself. The 
baseboard fan power header should be positioned within 177.8 mm [7 in.] from the 
center of the processor socket.
Table 10-1.  PWM Fan Frequency Specifications For 4-Pin Active Thermal Solution
Description
Min Frequency
Nominal Frequency
Max Frequency
Unit
PWM Control 
Frequency Range
21,000
25,000
28,000
Hz