NEC Intel Xeon E5-2430 N8101-572F User Manual
Product codes
N8101-572F
Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
255
Datasheet Volume One
Boxed Processor Specifications
10.3.1
Boxed Processor Cooling Requirements
As previously stated the boxed processor will have three thermal solutions available.
Each configuration will require unique design considerations. Meeting the processor’s
temperature specifications is also the function of the thermal design of the entire
temperature specifications is also the function of the thermal design of the entire
system, and ultimately the responsibility of the system integrator. The processor
temperature specifications are found in
of this document.
10.3.1.1
STS200C (Passive / Active Combination Heat Sink Solution)
The active configuration of the combination solution is designed to help pedestal
chassis users to meet the thermal processor requirements without the use of processor
chassis users to meet the thermal processor requirements without the use of processor
chassis ducting. However, it is strongly recommended to implement some form of air
duct to meet memory cooling and processor T
LA
temperature requirements. Use of the
active configuration in a 2U rackmount chassis is not recommended.
In the passive configuration it is assumed that a chassis duct will be implemented.
For a list processor and thermal solution boundary conditions, such as Psi
ca
, T
LA
,
airflow, flow impedance, etc, see
. It is recommended that
the ambient air temperature outside of the chassis be kept at or below 35
°
C. Meeting
the processor’s temperature specification is the responsibility of the system
integrator.This thermal solution is for use with processor SKUs no higher than 150W (8
Core) or 130W (4 and 6 core).
10.3.1.2
STS200P and STS200PNRW (25.5mm Tall Passive Heat Sink Solution)
(Blade + 1U + 2U Rack)
These passive solutions are intended for use in SSI Blade, 1U or 2U rack configurations.
It is assumed that a chassis duct will be implemented in all configurations.
It is assumed that a chassis duct will be implemented in all configurations.
For a list processor and thermal solution boundary conditions, such as Psi
ca
, T
LA
,
airflow, flow impedance, etc, see
. It is recommended that
the ambient air temperature outside of the chassis be kept at or below 35
°
C. Meeting
the processor’s temperature specification is the responsibility of the system integrator.
These thermal solutions are for use with processor SKUs no higher than 130W (6 and 8
Core), or 80W (4 Core).
Core), or 80W (4 Core).
Note:
Please refer to the Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product
Families Thermal/Mechanical Design Guide
for detailed mechanical drawings of the
STS200P and STS200PNRW.
Figure 10-12. Fan Cable Connector Pin Out For 4-Pin Active Thermal Solution