HP 701977-FL1 User Manual
2.
Lift the heat sink/fan assembly (2) straight up to remove it.
NOTE:
Due to the adhesive quality of the thermal material located between the fan/graphics
board heat sink assembly and graphics board components, it may be necessary to move the
graphics board heat sink from side to side to detach it from the system board.
graphics board heat sink from side to side to detach it from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the graphics
board heat sink and the graphics board each time the graphics board heat sink is removed:
Thermal paste is used on the largest component (1) and (2) on the graphics board and the
graphics board heat sink section (3) and (4) that service it.
Thermal paste is used on the largest component (1) and (2) on the graphics board and the
graphics board heat sink section (3) and (4) that service it.
Reverse this procedure to install the fan/graphics board heat sink assembly.
Component replacement procedures
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