Intel Pentium D 830 HH80551PG0802MN Data Sheet
Product codes
HH80551PG0802MN
Datasheet
39
Package Mechanical Specifications
3.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-out zone
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the
package substrate. See
requirements. A thermal and mechanical solution design must not intrude into the required keep-
out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the
package substrate. See
for keep-out zones.
The location and quantity of package capacitors may change due to manufacturing efficiencies but
will remain within the component keep-in.
will remain within the component keep-in.
3.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package. These
mechanical maximum load limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Also, any mechanical system or component testing should
not exceed the maximum limits. The processor package substrate should not be used as a
mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum
loading specification must be maintained by any thermal and mechanical solutions.
conditions, or standard use condition. Also, any mechanical system or component testing should
not exceed the maximum limits. The processor package substrate should not be used as a
mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum
loading specification must be maintained by any thermal and mechanical solutions.
.
3.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
experienced during heatsink removal.
Table 3-1. Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
Static
80 N [18 lbf]
311 N [70 lbf]
1, 2, 3
NOTES:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum spec-
ified load on the processor package.
ified load on the processor package.
3.
These specifications are based on limited testing for design characterization. Loading limits are for the package only and
does not include the limits of the processor socket.
does not include the limits of the processor socket.
Dynamic
—
756 N [170 lbf]
1, 3, 4
4.
Dynamic loading is defined as the sum of the load on the package from a 1 lb heatsink mass accelerating through a 11 ms
trapezoidal pulse of 50 g and the maximum static load.
trapezoidal pulse of 50 g and the maximum static load.
Table 3-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
311 N [70 lbf]
1, 4
NOTES:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
Tensile
111 N [25 lbf]
2, 4
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
Torque
3.95 N-m [35 lbf-in]
3, 4
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.
4.
These guidelines are based on limited testing for design characterization.