Intel Pentium D 830 HH80551PG0802MN Data Sheet
Product codes
HH80551PG0802MN
40
Datasheet
Package Mechanical Specifications
3.5
Package Insertion Specifications
The Pentium D processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design
Guide.
socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design
Guide.
3.6
Processor Mass Specification
The typical mass of the Pentium D processor is 22.03 g [0.78 oz]. This mass [weight] includes all
the components that are included in the package.
the components that are included in the package.
3.7
Processor Materials
lists some of the package components and associated materials.
3.8
Processor Markings
show the topside markings on the processor for the Pentium D processor
800 sequence. These diagrams are to aid in the identification of the Pentium D processor.
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 3-5. Processor Top-Side Marking Example (Intel
®
Pentium
®
D Processors 840, 830,
820)
ATPO
S/N
S/N
Processor Number/ S-Spec/
Country of Assy
INTEL
XXXXXXXX
3.20GHZ/2M/800/05B
840 SLxxx [COO]
[FPO]
m
©
‘04
Frequency/L2 Cache/Bus/
775_VR_CONFIG_05x
FPO
2-D Matrix Mark
Unique Unit
Identifier
ATPO Serial #
Identifier
ATPO Serial #
Brand