Intel Pentium D 830 HH80551PG0802MN Data Sheet
Product codes
HH80551PG0802MN
Datasheet
75
Thermal Specifications and Design Considerations
5
Thermal Specifications and
Design Considerations
Design Considerations
5.1
Processor Thermal Specifications
The Intel
®
Pentium
®
D processor requires a thermal solution to maintain temperatures within
operating limits as set forth in
. Any attempt to operate the processor outside these
operating limits may result in permanent damage to the processor and potentially other components
within the system. As processor technology changes, thermal management becomes increasingly
crucial when building computer systems. Maintaining the proper thermal environment is key to
reliable, long-term system operation.
within the system. As processor technology changes, thermal management becomes increasingly
crucial when building computer systems. Maintaining the proper thermal environment is key to
reliable, long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
features. Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the Intel
®
Pentium
®
D Processor and Intel
®
Pentium
®
Processor Extreme Edition 840 Thermal and
Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to
the boxed processor.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (T
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (T
C
) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in
. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The Pentium D processor has a methodology for managing processor temperatures that is intended
to support acoustic noise reduction through fan speed control. Selection of the appropriate fan
speed will be based on the temperature reported by the processor’s Thermal Diode. If the diode
temperature is greater than or equal to T
to support acoustic noise reduction through fan speed control. Selection of the appropriate fan
speed will be based on the temperature reported by the processor’s Thermal Diode. If the diode
temperature is greater than or equal to T
CONTROL
, then the processor case temperature must remain
at or below the temperature as specified by the thermal profile. If the diode temperature is less than
T
T
CONTROL
, then the case temperature is permitted to exceed the thermal profile, but the diode
temperature must remain at or below T
CONTROL
. Systems that implement fan speed control must
be designed to take these conditions into account. Systems that do not alter the fan speed only need
to ensure the case temperature meets the thermal profile specifications.
to ensure the case temperature meets the thermal profile specifications.
To determine a processor's case temperature specification based on the thermal profile, it is
necessary to accurately measure processor power dissipation. Intel has developed a methodology
for accurate power measurement that correlates to Intel test temperature and voltage conditions.
necessary to accurately measure processor power dissipation. Intel has developed a methodology
for accurate power measurement that correlates to Intel test temperature and voltage conditions.