Intel Pentium D 830 HH80551PG0802MN Data Sheet

Product codes

HH80551PG0802MN

Datasheet

Thermal Specifications and Design Considerations

Refer to the Intel

Pentium

D Processor and Intel

Pentium

Processor Extreme Edition 840

Thermal and Mechanical Design Guidelines and the Processor Power Characterization
Methodology for the details of this methodology.

The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in

Table 5-1

instead of the maximum processor power

consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to

Section 5.2

. In all cases, the Thermal Monitor feature

must be enabled for the processor to remain within specification.

Table 5-1. Processor Thermal Specifications

Processor

Number

Core Frequency

(GHz)

Thermal Design

Power (W)

Minimum

(°C)

Maximum T

(°C)

Notes

805

2.66 GHz (PRB = 0)

See

820

2.80 GHz (PRB = 0)

See

830

3 GHz (PRB = 1)

130

See

Table 5-2

and

Figure 5-1

1, 2

NOTES:

Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum pow-
er that the processor can dissipate.

This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum T

will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table

for the allowed combinations of power and T

840

3.20 GHz (PRB = 1)

130

See