Fujifilm Xeon 5050 S26361-F3248-L300 Data Sheet

Product codes

S26361-F3248-L300

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Mechanical Specifications

The Dual-Core Intel Xeon Processor 5000 series are packaged in a Flip Chip Land Grid
Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket. The
package consists of a processor core mounted on a pinless substrate with 771 lands. An
integrated heat spreader (IHS) is attached to the package substrate and core and
serves as the interface for processor component thermal solutions such as a heatsink.

Figure 3-1

shows a sketch of the processor package components and how they are

assembled together. .

The package components shown in

Figure 3-1

include the following:

1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor Core (die)
4. Package Substrate
5. Landside capacitors
6. Package Lands

Note:

This drawing is not to scale and is for reference only.

3.1

Package Mechanical Drawings

The package mechanical drawings are shown in

Figure 3-2

through

Figure 3-4

. The

drawings include dimensions necessary to design a thermal solution for the processor
including:

1. Package reference and tolerance dimensions (total height, length, width, an so

forth)

2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums

Note:

All drawing dimensions are in mm [in.].

Figure 3-1. Processor Package Assembly Sketch

IHS

Substrate

LGA771 Socket

System Board

Capacitors

Core (die)

TIM

Package Lands