Intel Xeon 3.20GHz Processor RK80546KG0882MM User Manual
Product codes
RK80546KG0882MM
Mechanical Requirements
R
14
mPGA604 Socket
Mechanical Design Guide
CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic
component exceeding 25g must be recyclable as per the European Blue Angel recycling design
guidelines.
component exceeding 25g must be recyclable as per the European Blue Angel recycling design
guidelines.
3.11
Lever Actuation Requirements
• 135º lever travel max.
• Pivot point in the center of the actuation area on the top of the socket.
• Pivot point in the center of the actuation area on the top of the socket.
3.12 Socket
Engagement/Disengagement
Force
The force on the actuation lever arm must not exceed 44N to engage or disengage the package into
the mPGA604 socket. Movement of the cover is limited to the plane parallel to the motherboard.
The processor package must not be utilized in the actuation of the socket. Any actuation must meet
or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of
Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces).
the mPGA604 socket. Movement of the cover is limited to the plane parallel to the motherboard.
The processor package must not be utilized in the actuation of the socket. Any actuation must meet
or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of
Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces).
3.13 Visual
Aids
The socket top will have markings identifying Pin 1. This marking will be represented by a clearly
visible triangular symbol (see
visible triangular symbol (see
3.14 Socket
BGA
Co-Planarity
The co-planarity (profile) requirement for all solder balls on the underside of the socket is located in
3.15
Solder Ball True Position
The solder ball pattern has a true position requirement with respect to Datum A, B, and C (see
3.16 Critical-to-Function
Dimensions
The mPGA604 socket shall accept a 604-pin processor pin field. All dimensions are metric.
Asymmetric features are designed to properly align the socket to the motherboard and prevent the
socket from being assembled incorrectly to the motherboard.
Asymmetric features are designed to properly align the socket to the motherboard and prevent the
socket from being assembled incorrectly to the motherboard.
Critical-to-function (CTF) dimensions are identified in
. The CTF values are detailed on
and take precedence over all values presented in this
document. Dimensional requirements identified in the drawing and in
must be met. These
dimensions will be verified as part of the validation process. Also, supplier will provide and