Intel Xeon 3.20GHz Processor RK80546KG0882MM User Manual

 

 

 

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maintain Critical Process Parameters controlling these CTFs or will provide direct measurements to 
meet ongoing quality requirements. 

 3-1. Package Critical-To-Function (CTF) Dimensions 

Socket Length 

Socket Width 

Socket Height (Interposer surface from MB) 

Assembled Seating Plane Flatness 

Ball Diameter 

True Position of Balls (pattern relating) 

Co-planarity (profile) of Balls 

Actuation Distance (Cover Travel) 

Through Cavity X 

Through Cavity Y 

Cover Hole Diameter (Must guarantee ZIF) 

Cover Hole Countersink Depth (Must guarantee ZIF) 

Cover Hole Countersink Diameter (Must guarantee ZIF) 

Cover Hole Virtual Condition (Pattern Locating) 

Cover Hole Virtual Condition (Feature Relating) 

Cover Hole Field Depth wrt Seating Plane 

Cover Thickness in Hole Area 

Au Thickness 

Ni Thickness 

Alignment Post Virtual Condition 

Contact Depth from Seating Plane 

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