Intel Xeon 3.20GHz Processor RK80546KG0882MM User Manual

 

 

17 

Socket electrical requirements are measured from the socked-seating plane of the processor test 
vehicle (PTV) to the component side of the socket PCB to which it is attached. All specification are 
maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent 
pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom 
of the processor pin field. 

 4-1. Electrical Requirements for Sockets 

1 

Mat lloop inductance, Loop  

<4.33 nH  

Refer to 

, Item 1 

2 

Mated partial mutual inductance, L 

NA  

Refer to 

,  

Item 2a 

3 

Maximum mutual capacitance, C  

<1 pF  

Refer to 

  

Item 3  

4 

Maximum Ave Contact Resistance 

≤ 17 mΩ Refer 

, Item 4. 

Refer to 

 for 

more detail. 
Refer to mPGA603 Socket 
Design Guidelines 

for 

electrical parameters with 
INT3 packages. 

5 

Measurement frequency(s) for 
Pin-to-Pin/Connector-to-
Connector capacitance.  

400 MHz  

  

6 

Measurement frequency(s) for 
Pin-to-Pin/Connector-to-
Connector inductance.  

1 GHz  

  

7 

Dielectric Withstand Voltage  

360 Volts RMS  

  

8 

Insulation Resistance  

800 MΩ 

  

9 

Contact Current Rating  

Read & record  

  

 4-2. Definitions (Sheet 1 of 2) 

1 

Mated loop inductance, Lloop 
Refer to 

The inductance calculated for two conductors, 
considering one forward conductor and one 
return conductor.  

2a  

Mated mutual inductance, L 
Refer to 

The inductance on a conductor due to any 
single neighboring conductor.   

3 

Maximum mutual capacitance, C 
Refer to 

The capacitance between two pins/connectors.