Intel Xeon 3.20GHz Processor RK80546KG0882MM User Manual
Product codes
RK80546KG0882MM
R
Electrical Requirements
mPGA604 Socket
23
Mechanical Design Guide
4.3 Inductance
The bottom fixture for the inductance measurement is a ground plane on the secondary side of the
motherboard with all pins grounded. The component side of the socket PCB does not contain a
plane. The top fixture is the package, which contains pins that will connect to the socket.
motherboard with all pins grounded. The component side of the socket PCB does not contain a
plane. The top fixture is the package, which contains pins that will connect to the socket.
shows the inductance measurement fixture cross-section and the inductance measurement
methodology. The first figure shows the entire assembly. The second figure shows the assembly
without the socket; the socket-seating plane of the package is directly mounted to the component
side of the socket PCB. This is used to calibrate out the fixture contribution. The materials for the
fixture must match the materials used in the processor. Note the probe pad features exist on the
topside of the top fixture, and the shorting plane exists only on the bottom side of the bottom fixture.
methodology. The first figure shows the entire assembly. The second figure shows the assembly
without the socket; the socket-seating plane of the package is directly mounted to the component
side of the socket PCB. This is used to calibrate out the fixture contribution. The materials for the
fixture must match the materials used in the processor. Note the probe pad features exist on the
topside of the top fixture, and the shorting plane exists only on the bottom side of the bottom fixture.
Figure
4-4. Inductance Measurement Fixture Cross-Section
Figure
4-5. Inductance and Capacitance Fixture