Intel Xeon 3.20GHz Processor RK80546KG0882MM User Manual
Product codes
RK80546KG0882MM
R
Electrical Requirements
mPGA604 Socket
25
Mechanical Design Guide
4.3.2
Correlation of Measurement and Model Data Inductance
To correlate the measurement and model data for loop inductance, one unit of measured socket
assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture)
will be chosen for cross sectioning. Both units will be modeled based on data from cross sectioning
using Ansoft* 3D. The sandwich inductance will be subtracted from socket assembly inductance for
both measured and modeled data. This procedure results in loop inductance for socket contact. This
final result can be compared with the loop inductance from the supplier model for the socket. If
there is any difference between them, it will be called the de-embedded correction factor. Adding
the test board to the socket and then eliminating the contribution of the fixture creates this correction
factor because inductance is not linear.
assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture)
will be chosen for cross sectioning. Both units will be modeled based on data from cross sectioning
using Ansoft* 3D. The sandwich inductance will be subtracted from socket assembly inductance for
both measured and modeled data. This procedure results in loop inductance for socket contact. This
final result can be compared with the loop inductance from the supplier model for the socket. If
there is any difference between them, it will be called the de-embedded correction factor. Adding
the test board to the socket and then eliminating the contribution of the fixture creates this correction
factor because inductance is not linear.
4.4 Pin-to-Pin
Capacitance
Pin-to-pin capacitance shall be measured using configuration 4, with the motherboard not connected
and only the measurements with the package mounted on the socket will be taken. Capture data at
frequency specified in item 5 of
and only the measurements with the package mounted on the socket will be taken. Capture data at
frequency specified in item 5 of
.
4.5
Dielectric Withstand Voltage
No disruptive discharge or leakage greater than 0.5 mA is allowed when subjected to 360 V RMS.
The sockets shall be tested according to EIA-364, Test Procedure 20A, Method 1. The sockets shall
be tested unmounted and unmated. Barometric pressure shall be equivalent to Sea Level. The
sample size is 25 contact-to-contact pairs on each of 4 sockets. The contacts shall be randomly
chosen.
The sockets shall be tested according to EIA-364, Test Procedure 20A, Method 1. The sockets shall
be tested unmounted and unmated. Barometric pressure shall be equivalent to Sea Level. The
sample size is 25 contact-to-contact pairs on each of 4 sockets. The contacts shall be randomly
chosen.
4.6 Insulation
Resistance
The Insulation Resistance shall be greater than 800 M Ohm when subjected to 500 V DC. The
sockets shall be tested according to EIA-364, Test Procedure 21. The sockets shall be tested
unmated and unmounted. The sample size is 25 contact-to-contact pairs on each of 4 sockets. The
contacts shall be randomly chosen.
sockets shall be tested according to EIA-364, Test Procedure 21. The sockets shall be tested
unmated and unmounted. The sample size is 25 contact-to-contact pairs on each of 4 sockets. The
contacts shall be randomly chosen.
4.7
Contact Current Rating
Measure and record the temperature rise when the socket is subjected to rated current of 0.8A. The
sockets shall be tested according to EIA-364, Test Procedure 70A, Test Method 1. The sockets shall
be mounted on a test-board and mated with a package so those 370 pins are connected in series. The
recommended Test-board is the FSETV4 Rev 1 and the recommended package is FSETV5 Rev 1.
The wiring list is shown below. Mount the thermocouple as near to contact N3 or N 7 as possible.
Short the daisy chains by means of the edge fingers if possible. Sample size is one socket.
sockets shall be tested according to EIA-364, Test Procedure 70A, Test Method 1. The sockets shall
be mounted on a test-board and mated with a package so those 370 pins are connected in series. The
recommended Test-board is the FSETV4 Rev 1 and the recommended package is FSETV5 Rev 1.
The wiring list is shown below. Mount the thermocouple as near to contact N3 or N 7 as possible.
Short the daisy chains by means of the edge fingers if possible. Sample size is one socket.