Microchip Technology IC PIC MCU PIC16F1937-I/PT TQFP-44 MCP PIC16F1937-I/PT Data Sheet
Product codes
PIC16F1937-I/PT
PIC16(L)F1934/6/7
DS41364E-page 392
2008-2011 Microchip Technology Inc.
30.6
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C
Operating temperature -40°C
T
A
+125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA
Thermal Resistance Junction to Ambient
60
C/W
28-pin SPDIP package
80
C/W
28-pin SOIC package
90
C/W
28-pin SSOP package
27.5
C/W
28-pin UQFN 4x4mm package
27.5
C/W
28-pin QFN 6x6mm package
47.2
C/W
40-pin PDIP package
46
C/W
44-pin TQFP package
24.4
C/W
44-pin QFN 8x8mm package
TH02
JC
Thermal Resistance Junction to Case
31.4
C/W
28-pin SPDIP package
24
C/W
28-pin SOIC package
24
C/W
28-pin SSOP package
24
C/W
28-pin UQFN 4x4mm package
24
C/W
28-pin QFN 6x6mm package
24.7
C/W
40-pin PDIP package
14.5
C/W
44-pin TQFP package
20
C/W
44-pin QFN 8x8mm package
TH03
T
JMAX
Maximum Junction Temperature
150
C
TH04
PD
Power Dissipation
—
W
PD = P
INTERNAL
+ P
I
/
O
TH05
P
INTERNAL
Internal Power Dissipation
—
W
P
INTERNAL
= I
DD
x V
DD(1)
TH06
P
I
/
O
I/O Power Dissipation
—
W
P
I
/
O
=
(I
OL
* V
OL
) +
(I
OH
* (V
DD
- V
OH
))
TH07
P
DER
Derated Power
—
W
P
DER
= PD
MAX
(T
J
- T
A
)/
JA(2)
Note 1:
I
DD
is current to run the chip alone without driving any load on the output pins.
2:
T
A
= Ambient Temperature
3:
T
J
= Junction Temperature