STMicroelectronics M24C64-WBN6P Memory IC M24C64-WBN6P Data Sheet
Product codes
M24C64-WBN6P
DocID16891 Rev 28
M24C64-W M24C64-R M24C64-F
41
Figure 3. 5-bump WLCSP connections (top view)
Note:
Inputs E2, E1, E0 are internally connected to (001). Please refer to
for further
explanations.
Figure 4. 8-bump thin WLCSP connections (top view)
Caution:
As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet
(UV) light, EEPROM dice delivered in wafer form or in WLCSP package by
STMicroelectronics must never be exposed to UV light.
(UV) light, EEPROM dice delivered in wafer form or in WLCSP package by
STMicroelectronics must never be exposed to UV light.
MS18655V3
V
CC
V
SS
SDA
WC
SCL
MS30479V1
WC
VCC
E1
SDA
E0
SCL
VSS
E2