Microchip Technology MA330019-2 Data Sheet
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
DS70292G-page 338
© 2007-2012 Microchip Technology Inc.
30.1
DC Characteristics
TABLE 30-1:
OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD
Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ32GP302/304,
dsPIC33FJ64GPX02/X04, and
dsPIC33FJ128GPX02/X04
—
3.0-3.6V
(1)
-40°C to +85°C
40
—
3.0-3.6V
(1)
-40°C to +125°C
40
Note 1: Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter
for the minimum and maximum BOR values.
TABLE 30-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Industrial Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Extended Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+155
°C
Operating Ambient Temperature Range
T
A
-40
—
+125
°C
Power Dissipation:
Internal chip power dissipation:
Internal chip power dissipation:
P
INT
= V
DD
x (I
DD
–
Σ I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O =
Σ ({V
DD
– V
OH
} x I
OH
) +
Σ (V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
– T
A
)/
θ
JA
W
TABLE 30-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Note
Package Thermal Resistance, 44-pin QFN
θ
JA
30
—
°C/W
1
Package Thermal Resistance, 44-pin TFQP
θ
JA
40
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
θ
JA
45
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θ
JA
50
—
°C/W
1
Package Thermal Resistance, 28-pin QFN-S
θ
JA
30
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-
JA
(
θ
JA
) numbers are achieved by package simulations.