Microchip Technology MA330019-2 Data Sheet
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
DS70292G-page 398
© 2007-2012 Microchip Technology Inc.
TABLE 31-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 31-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC
CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Operating temperature
-40°C
≤ T
A
≤ +150°C for High Temperature
Param
No.
Symbol
Characteristic
(1)
Min
Typ
Max
Units
Conditions
HSP35 TscH2doV,
TscL2doV
SDOx Data Output Valid after
SCKx Edge
SCKx Edge
—
—
35
ns
—
HSP40 TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
to SCKx Edge
25
—
—
ns
—
HSP41 TscH2diL,
TscL2diL
Hold Time of SDIx Data Input to
SCKx Edge
SCKx Edge
25
—
—
ns
—
HSP51 TssH2doZ
SSx
↑ to SDOx Output
High-Impedance
15
—
55
ns
See Note 2
Note 1: These parameters are characterized but not tested in manufacturing.
2: Assumes 50 pF load on all SPIx pins.
AC
CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Operating temperature
-40°C
≤ T
A
≤ +150°C for High Temperature
Param
No.
Symbol
Characteristic
(1)
Min
Typ
Max
Units
Conditions
HSP35
TscH2doV,
TscL2doV
TscL2doV
SDOx Data Output Valid after
SCKx Edge
SCKx Edge
—
—
35
ns
—
HSP40
TdiV2scH,
TdiV2scL
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
to SCKx Edge
25
—
—
ns
—
HSP41
TscH2diL,
TscL2diL
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
to SCKx Edge
25
—
—
ns
—
HSP51
TssH2doZ SSx
↑ to SDO
X
Output
High-Impedance
15
—
55
ns
See Note 2
HSP60
TssL2doV
SDOx Data Output Valid after
SSx Edge
SSx Edge
—
—
55
ns
—
Note 1: These parameters are characterized but not tested in manufacturing.
2: Assumes 50 pF load on all SPIx pins.