Microchip Technology MA330019-2 Data Sheet
© 2007-2012 Microchip Technology Inc.
DS70292G-page 421
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
Revision D (November 2009)
The revision includes the following global update:
• Added Note 2 to the shaded table that appears at
• Added Note 2 to the shaded table that appears at
the beginning of each chapter. This new note
provides information regarding the availability of
registers and their associated bits
provides information regarding the availability of
registers and their associated bits
This revision also includes minor typographical and
formatting changes throughout the data sheet text.
All other major changes are referenced by their
respective section in the following table.
formatting changes throughout the data sheet text.
All other major changes are referenced by their
respective section in the following table.
TABLE A-3:
MAJOR SECTION UPDATES
Section Name
Update Description
“High-Performance, 16-bit Digital Signal
Controllers”
Controllers”
Added information on high temperature operation (see “Operating
Range:”).
Range:”).
Section 11.0 “I/O Ports”
Changed the reference to digital-only pins to 5V tolerant pins in the
second paragraph of Section 11.2 “Open-Drain Configuration”.
second paragraph of Section 11.2 “Open-Drain Configuration”.
Section 18.0 “Universal Asynchronous
Receiver Transmitter (UART)”
Receiver Transmitter (UART)”
Updated the two baud rate range features to: 10 Mbps to 38 bps at
40 MIPS.
40 MIPS.
Section 21.0 “10-bit/12-bit Analog-to-Digital
Converter (ADC)”
Converter (ADC)”
Updated the ADC block diagrams (see Figure 21-1 and Figure 21-2).
Section 22.0 “Audio Digital-to-Analog
Converter (DAC)”
Converter (DAC)”
Removed last sentence of the first paragraph in the section.
Added a shaded note to Section 22.2 “DAC Module Operation”.
Updated Figure 22-2: “Audio DAC Output for Ramp Input
(Unsigned)”.
(Unsigned)”.
Section 27.0 “Special Features”
Updated the second paragraph and removed the fourth paragraph in
Section 27.1 “Configuration Bits”.
Section 27.1 “Configuration Bits”.
Updated the Device Configuration Register Map (see Table 27-1).
Section 30.0 “Electrical Characteristics”
Updated the Absolute Maximum Ratings for high temperature and
added Note 4.
Removed parameters DI26, DI28, and DI29 from the I/O Pin Input
Specifications (see Table 30-9).
Updated the SPIx Module Slave Mode (CKE = 1) Timing
Characteristics (see Figure 30-12).
added Note 4.
Removed parameters DI26, DI28, and DI29 from the I/O Pin Input
Specifications (see Table 30-9).
Updated the SPIx Module Slave Mode (CKE = 1) Timing
Characteristics (see Figure 30-12).
Removed Table 30-43: Audio DAC Module Specifications. Original
contents were updated and combined with Table 30-42 of the same
name.
contents were updated and combined with Table 30-42 of the same
name.
Section 31.0 “High Temperature Electrical
Characteristics”
Characteristics”
Added new chapter with high temperature specifications.
“Product Identification System”
Added the “H” definition for high temperature.