Microchip Technology MA330018 Data Sheet
dsPIC33FJ32MC302/304, dsPIC33FJ64MCX02/X04 AND dsPIC33FJ128MCX02/X04
DS70291G-page 414
© 2007-2012 Microchip Technology Inc.
32.1
High Temperature DC Characteristics
TABLE 32-1:
OPERATING MIPS VS. VOLTAGE
TABLE 32-2:
THERMAL OPERATING CONDITIONS
TABLE 32-3:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Characteristic
V
DD
Range
(in Volts)
Temperature Range
(in °C)
Max MIPS
dsPIC33FJ32MC302/304,
dsPIC33FJ64MCX02/X04 and
dsPIC33FJ128MCX02/X04
—
3.0V to 3.6V
(1)
-40°C to +150°C
20
Note 1: Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized.
Rating
Symbol
Min
Typ
Max
Unit
High Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+155
°C
Operating Ambient Temperature Range
T
A
-40
—
+150
°C
Power Dissipation:
Internal chip power dissipation:
Internal chip power dissipation:
P
INT
= V
DD
x (I
DD
-
Σ I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O =
Σ ({V
DD
- V
OH
} x I
OH
) +
Σ (V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
- T
A
)/
θ
JA
W
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
(unless otherwise stated)
Operating temperature
-40°C
≤ T
A
≤ +150°C for High Temperature
Parameter
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
Operating Voltage
HDC10
HDC10
Supply Voltage
V
V
DD
—
3.0
3.3
3.6
V
-40°C to +150°C
Note 1: Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized.