Microchip Technology MA330031-2 Data Sheet

 2011-2013 Microchip Technology Inc.

DS70000657H-page 505

     

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

For the most current package drawings, please see the Microchip Packaging Specification located at 
http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Leads

N

64

Lead Pitch

e

0.50 BSC

Overall Height

A

–

–

1.20

Molded Package Thickness

A2

0.95

1.00

1.05

Standoff  

A1

0.05

–

0.15

Foot Length

L

0.45

0.60

0.75

Footprint

L1

1.00 REF

Foot Angle

φ

0°

3.5°

7°

Overall Width

E

12.00 BSC

Overall Length

D

12.00 BSC

Molded Package Width

E1

10.00 BSC

Molded Package Length

D1

10.00 BSC

Lead Thickness

c

0.09

–

0.20

Lead Width

b

0.17

0.22

0.27

Mold Draft Angle Top

α

11°

12°

13°

Mold Draft Angle Bottom

β

11°

12°

13°

D

D1

E

E1

e

b

N

NOTE 1

1 2 3

NOTE 2

c

L

A1

L1

A2

A

φ

β

α

Microchip Technology Drawing C04-085B