Microchip Technology MA330026 Data Sheet
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DS70000652F-page 282
2011-2014 Microchip Technology Inc.
26.1
DC Characteristics
TABLE 26-1:
OPERATING MIPS vs. VOLTAGE
Characteristic
V
DD
Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104
DC5
V
BOR
-3.6V
(
)
-40°C to +85°C
16
V
BOR
-3.6V
(
)
-40°C to +125°C
16
Note 1:
Overall functional device operation at V
BOR
< V
DD
< V
DDMIN
is ensured but not characterized. All device
analog modules, such as the ADC, etc., will function but with degraded performance below V
DDMIN
.
TABLE 26-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Industrial Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Extended Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+140
°C
Operating Ambient Temperature Range
T
A
-40
—
+125
°C
Power Dissipation:
Internal Chip Power Dissipation:
Internal Chip Power Dissipation:
P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ PIO
W
I/O Pin Power Dissipation:
I/O =
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
– T
A
)/
JA
W
TABLE 26-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 18-pin PDIP
JA
50
—
°C/W
Package Thermal Resistance, 20-pin PDIP
JA
50
—
°C/W
Package Thermal Resistance, 28-pin SPDIP
JA
50
—
°C/W
Package Thermal Resistance, 18-pin SOIC
JA
63
—
°C/W
Package Thermal Resistance, 20-pin SOIC
JA
63
—
°C/W
Package Thermal Resistance, 28-pin SOIC
JA
55
—
°C/W
Package Thermal Resistance, 20-pin SSOP
JA
90
—
°C/W
Package Thermal Resistance, 28-pin SSOP
JA
71
—
°C/W
Package Thermal Resistance, 28-pin QFN (6x6 mm)
JA
37
—
°C/W
Package Thermal Resistance, 36-pin VTLA (5x5 mm)
JA
31.1
—
°C/W
Package Thermal Resistance, 44-pin TQFP
JA
45
—
°C/W
Package Thermal Resistance, 44-pin QFN
JA
32
—
°C/W
Package Thermal Resistance, 44-pin VTLA
JA
30
—
°C/W
Note 1:
Junction to ambient thermal resistance; Theta-
JA
(
JA
) numbers are achieved by package simulations.
2:
This package is available in dsPIC33FJ32(GP/MC)104 devices only.