Microchip Technology AC164139 Data Sheet
PIC24FJ256DA210 FAMILY
DS39969B-page 372
2010 Microchip Technology Inc.
30.1
DC Characteristics
FIGURE 30-1:
PIC24FJ256DA210 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 30-1:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
PIC24FJ256DA210 family:
Operating Junction Temperature Range
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Power Dissipation (with ENVREG = 1):
Internal Chip Power Dissipation: P
Internal Chip Power Dissipation: P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
P
I
/
O
=
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
JMAX
– T
A
)/
JA
W
Frequency
V
o
lt
ag
e (V
DD
)
V
BOR
32 MHz
3.6V
3.6V
PIC24FJXXXDA1
V
BOR
2.2V
2.2V
Note:
V
CAP
(nominal On-Chip Regulator output voltage) = 1.8V.
TABLE 30-2:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Note
Package Thermal Resistance, 12x12x1 mm TQFP
JA
69.4
—
°C/W
(Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP
JA
76.6
—
°C/W
(Note 1)
Package Thermal Resistance, 9x9x0.9 mm QFN
JA
28.0
—
°C/W
(Note 1)
Package Thermal Resistance, 10x10x1.1 mm BGA
JA
40.2
—
°C/W
(Note 1)
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.