Microchip Technology MCP1630DM-DDBS1 Data Sheet

©

 2007 Microchip Technology Inc.

DS41211D-page 161

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.

For the most current package drawings, please see the Microchip Packaging Specification located at 
http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

1.27 BSC

Overall Height

A

–

–

1.75

Molded Package Thickness

A2

1.25

–

–

Standoff  

§

A1

0.10

–

0.25

Overall Width

E

6.00 BSC

Molded Package Width

E1

3.90 BSC

Overall Length

D

4.90 BSC

Chamfer (optional)

h

0.25

–

0.50

Foot Length

L

0.40

–

1.27

Footprint

L1

1.04 REF

Foot Angle

φ

0°

–

8°

Lead Thickness

c

0.17

–

0.25

Lead Width

b

0.31

–

0.51

Mold Draft Angle Top

α

5°

–

15°

Mold Draft Angle Bottom

β

5°

–

15°

D

N

e

E

E1

NOTE 1

1

2

3

b

A

A1

A2

L

L1

c

h

h

φ

β

α

Microchip Technology Drawing C04-057B