Microchip Technology MCP1630DM-DDBS1 Data Sheet
PIC12F683
DS41211D-page 162
©
2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
0.80 BSC
Overall Height
A
0.80
0.90
1.00
Standoff A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
4.00 BSC
Exposed Pad Width
E2
0.00
2.20
2.80
Overall Width
E
4.00 BSC
Exposed Pad Length
D2
0.00
3.00
3.60
Contact Width
b
0.25
0.30
0.35
Contact Length
L
0.30
0.55
0.65
Contact-to-Exposed Pad
K
0.20
–
–
D
N
E
NOTE 1
1
2
A3
A
A1
NOTE 2
NOTE 1
D2
1
2
E2
L
N
e
b
K
EXPOSED
PAD
TOP VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-131C