STMicroelectronics M93C66-WMN6P Memory IC M93C66-WMN6P Data Sheet
Product codes
M93C66-WMN6P
Package mechanical data
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x
DocID4997 Rev 15
11
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at:
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at:
www.st.com
.
ECOPACK® is an ST trademark .
Figure 13. PDIP8 – 8 lead plastic dual in-line package, 300 mils body width,
package outline
1. Drawing is not to scale.
Table 18. PDIP8 – 8 lead plastic dual in-line package, 300 mils body width,
package mechanical data
Symbol
millimeters
inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ.
Min.
Max.
Typ.
Min.
Max.
A
-
-
5.33
-
-
0.2098
A1
-
0.38
-
-
0.015
-
A2
3.3
2.92
4.95
0.1299
0.115
0.1949
b
0.46
0.36
0.56
0.0181
0.0142
0.022
b2
1.52
1.14
1.78
0.0598
0.0449
0.0701
c
0.25
0.2
0.36
0.0098
0.0079
0.0142
D
9.27
9.02
10.16
0.365
0.3551
0.4
E
7.87
7.62
8.26
0.3098
0.3
0.3252
E1
6.35
6.1
7.11
0.25
0.2402
0.2799
e
2.54
-
-
0.1
-
-
eA
7.62
-
-
0.3
-
-
eB
-
-
10.92
-
-
0.4299
L
3.3
2.92
3.81
0.1299
0.115
0.15
PDIP-B
A2
A1
A
L
b
e
D
E1
8
1
c
eA
b2
eB
E