Microchip Technology MA330020 Data Sheet
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
DS70000318G-page 334
2008-2014 Microchip Technology Inc.
25.1
High-Temperature DC Characteristics
TABLE 25-1:
OPERATING MIPS VS. VOLTAGE
Note 1:
Overall functional device operation at V
BORMIN
< V
DD
< V
DDMIN
is tested but not characterized. All device
analog modules such as the ADC, etc., will function but with degraded performance below V
DDMIN
. Refer to
Parameter
in
for BOR values.
TABLE 25-2:
THERMAL OPERATING CONDITIONS
TABLE 25-3:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Characteristic
V
DD
Range
(in Volts)
Temperature Range
(in °C)
Max MIPS
dsPIC33FJ06GS101/X02 and
dsPIC33FJ16GSX02/X04
—
3.0V to 3.6V
)
-40°C to +150°C
20
Rating
Symbol
Min
Typ
Max
Unit
High-Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+155
°C
Operating Ambient Temperature Range
T
A
-40
—
+150
°C
Power Dissipation:
Internal chip power dissipation:
Internal chip power dissipation:
P
INT
= V
DD
x (I
DD
-
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O =
({V
DD
- V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
- T
A
)/
JA
W
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
(unless otherwise stated)
Operating temperature
-40°C
T
A
+150°C for High Temperature
Parameter
No.
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
Operating Voltage
HDC10
Supply Voltage
V
DD
—
3.0
3.3
3.6
V
-40°C to +150°C