Microchip Technology MA330020 Data Sheet
2008-2014 Microchip Technology Inc.
DS70000318G-page 335
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
TABLE 25-4:
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
(unless otherwise stated)
Operating temperature
-40°C
T
A
+150°C for High Temperature
Parameter
No.
Typical
(
)
Max
Units
Conditions
Power-Down Current (I
PD
)
)
HDC60e
1000
2000
A
+150°C
3.3V
Base Power-Down Current
HDC61c
100
110
A
+150°C
3.3V
Watchdog Timer Current:
I
WDT
(
)
Note 1:
Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
2:
I
PD
(Sleep) current is measured as follows:
•
CPU core is off, oscillator is configured in EC mode and external clock active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
•
CLKO is configured as an I/O input pin in the Configuration Word
•
All I/O pins are configured as inputs and pulled to V
SS
•
MCLR = V
DD
, WDT and FSCM are disabled
•
All peripheral modules are disabled (PMDx bits are all ones)
•
The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in
Sleep mode)
Sleep mode)
•
JTAG disabled
3:
The
current is the additional current consumed when the WDT module is enabled. This current should
be added to the base I
PD
current.
4:
These currents are measured on the device containing the most memory in this family.