Microchip Technology MA330031 Data Sheet

Page of 530
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
DS70000657H-page 468
 2011-2013 Microchip Technology Inc.
31.1
High-Temperature DC Characteristics
TABLE 31-1:
OPERATING MIPS VS. VOLTAGE
TABLE 31-2:
THERMAL OPERATING CONDITIONS
TABLE 31-3:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Characteristic
V
DD
 Range
(in Volts)
Temperature Range
(in °C)
Max MIPS
dsPIC33EPXXXGP50X, 
dsPIC33EPXXXMC20X/50X and 
PIC24EPXXXGP/MC20X
HDC5
3.0 to 3.6V
(
)
-40°C to +150°C
40
Note 1:
Device is functional at V
BORMIN
 < V
DD
 < V
DDMIN
. Analog modules, such as the ADC, may have degraded 
performance. Device functionality is tested but not characterized.
Rating
Symbol
Min
Typ
Max
Unit
High-Temperature Devices
Operating Junction Temperature Range
T
J
-40
+155
°C
Operating Ambient Temperature Range
T
A
-40
+150
°C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT
 = V
DD
 x (I
DD
 – 
 I
OH
P
D
P
INT
 + P
I
/
O
W
I/O Pin Power Dissipation:
I/O = 
 ({V
DD
 – V
OH
} x I
OH
) + 
 (V
OL
 x I
OL
Maximum Allowed Power Dissipation
P
DMAX
(T
J
 – T
A
)/
JA
W
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
-40°C 
 T
A
 
 +150°C
Parameter 
No. 
Symbol
Characteristic
Min
Typ
Max
Units
Conditions
Operating Voltage
HDC10
Supply Voltage
V
DD
3.0
3.3
3.6
V
-40°C to +150°C