Microchip Technology MA330024 Data Sheet

 2009-2014 Microchip Technology Inc.

DS7000591F-page 23

Getting started with the dsPIC33FJ32GS406/606/
608/610 and dsPIC33FJ64GS406/606/608/610
family of 16-bit Digital Signal Controllers (DSC)
requires attention to a minimal set of device pin
connections before proceeding with development.
The following is a list of pin names, which must
always be connected:

• All  V

DD

 and V

SS

 pins 

(see 

• All  AV

DD

 and AV

SS

 pins (regardless if ADC module 

is not used) 
(see 

• V

CAP

 

(see 

) 

• MCLR pin 

(see 

• PGECx/PGEDx pins used for In-Circuit Serial 

Programming™ (ICSP™) and debugging purposes 
(see 

)

• OSC1 and OSC2 pins when external oscillator 

source is used 
(see 

)

The use of decoupling capacitors on every pair of
power supply pins, such as V

DD

, V

SS

, AV

DD

 and

AV

SS

, is required. 

Consider the following criteria when using decoupling
capacitors:

• Value and type of capacitor: Recommendation of 

0.1 µF (100 nF), 10-20V. This capacitor should be a 
low-ESR and have resonance frequency in the 
range of 20 MHz and higher. It is recommended that 
ceramic capacitors be used.

• Placement on the printed circuit board: The 

decoupling capacitors should be placed as close to 
the pins as possible. It is recommended to place the 
capacitors on the same side of the board as the 
device. If space is constricted, the capacitor can be 
placed on another layer on the PCB using a via; 
however, ensure that the trace length from the pin to 
the capacitor is within one-quarter inch (6 mm) in 
length.

• Handling high-frequency noise: If the board is 

experiencing high-frequency noise, upward of tens 
of MHz, add a second ceramic-type capacitor in par-
allel to the above described decoupling capacitor. 
The value of the second capacitor can be in the 
range of 0.01 µF to 0.001 µF. Place this second 
capacitor next to the primary decoupling capacitor. 
In high-speed circuit designs, consider implement-
ing a decade pair of capacitances as close to the 
power and ground pins as possible. For example, 
0.1 µF in parallel with 0.001 µF.

• Maximizing performance: On the board layout 

from the power supply circuit, run the power and 
return traces to the decoupling capacitors first, and 
then to the device pins. This ensures that the 
decoupling capacitors are first in the power chain. 
Equally important is to keep the trace length 
between the capacitor and the power pins to a 
minimum, thereby reducing PCB track inductance.

Note 1: This data sheet summarizes the features

of the dsPIC33FJ32GS406/606/608/610
and dsPIC33FJ64GS406/606/608/610
family of devices. It is not intended to
be a comprehensive reference source.
To complement the information in
this

data sheet, refer to the “dsPIC33/

PIC24 Family Reference Manual”.
Please see the Microchip web site
(

www.microchip.com

) for the latest

dsPIC33/PIC24 Family Reference Man-
ual sections. The information in this
data sheet supersedes the information
in the FRM.

2: Some registers and associated bits

described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.