Microchip Technology MA330016 Data Sheet

Page of 300
© 2007-2011 Microchip Technology Inc.
DS70290J-page 259
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
TABLE 23-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 23-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC 
CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
-40°C 
≤ T
A
 
≤ +150°C for High Temperature
Param
No.
Symbol
Characteristic
(1)
Min
Typ
Max
Units
Conditions
HSP35 TscH2doV,
TscL2doV
SDOx Data Output Valid after 
SCKx Edge
35
ns
HSP40 TdiV2scH, 
TdiV2scL
Setup Time of SDIx Data Input 
to SCKx Edge
25
ns
HSP41 TscH2diL, 
TscL2diL
Hold Time of SDIx Data Input to 
SCKx Edge 
25
ns
HSP51 TssH2doZ
SSx 
↑  to SDOx Output
High-Impedance
15
55
ns
See Note 2
Note 1: These parameters are characterized but not tested in manufacturing. 
2: Assumes 50 pF load on all SPIx pins.
AC 
CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
-40°C 
≤ T
A
 
≤ +150°C for High Temperature
Param
No.
Symbol
Characteristic
(1)
Min
Typ
Max
Units
Conditions
HSP35
TscH2doV,
TscL2doV
SDOx Data Output Valid after
SCKx Edge
35
ns
HSP40
TdiV2scH, 
TdiV2scL
Setup Time of SDIx Data Input
to SCKx Edge
25
ns
HSP41
TscH2diL, 
TscL2diL
Hold Time of SDIx Data Input
to SCKx Edge
25
ns
HSP51
TssH2doZ SSx 
↑  to SDO
X
 Output
High-Impedance
15
55
ns
See Note 2
HSP60
TssL2doV
SDOx Data Output Valid after
SSx Edge
55
ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Assumes 50 pF load on all SPIx pins.
TABLE 23-14: INTERNAL RC ACCURACY
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
-40°C
≤T
A
≤+150°C for Extended
Param
No.
Characteristic
Min
Typ
Max
Units
Conditions
LPRC @ 32.768 kHz
(1,2)
HF21
LPRC
-70
+70
%
-40°C 
≤ T
A
 
≤ +150°C
V
DD
 = 3.0-3.6V
Note 1: Change of LPRC frequency as V
DD
 changes.
2: LPRC accuracy impacts the Watchdog Timer Time-out Period (T
WDT
 for more information.