Microchip Technology TDGL019 Data Sheet

© 2011-2014 Microchip Technology Inc.

DS60001168F-page 328

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

   

Architecture

MX = M4K

®

 MCU core

Product Groups

1XX = General purpose microcontroller family
2XX = General purpose microcontroller family

Flash Memory Family

F

= Flash program memory

Program Memory Size 016  = 16K

032  = 32K
064  = 64K
128  = 128K
256  = 256K

Pin Count

B

= 28-pin

C

= 36-pin

D

= 44-pin

Speed

40

= 40 MHz

50

= 50 MHz

Temperature Range

I

= -40°C to +85°C (Industrial)

V

= -40°C to +105°C (V-temp)

Package

ML = 28-Lead (6x6 mm) QFN (Plastic Quad Flatpack)

ML = 44-Lead (8x8 mm) QFN (Plastic Quad Flatpack)

PT = 44-Lead (10x10x1 mm) TQFP (Plastic Thin Quad Flatpack) 

SO = 28-Lead (7.50 mm) SOIC (Plastic Small Outline)

SP = 28-Lead (300 mil) SPDIP (Skinny Plastic Dual In-line)

SS = 28-Lead (5.30 mm) SSOP (Plastic Shrink Small Outline) 

TL

= 36-Lead (5x5 mm) VTLA (Very Thin Leadless Array) 

TL

= 44-Lead (6x6 mm) VTLA (Very Thin Leadless Array) 

Pattern

Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise)
ES = Engineering Sample

PIC32MX110F032DT-I/PT:
General purpose PIC32, 
32-bit RISC MCU with M4K

®

 core,

32 KB program memory, 44-pin, 
Industrial temperature,
TQFP package.