Microchip Technology MCP1631RD-MCC2 Data Sheet
2006-2012 Microchip Technology Inc.
DS41291G-page 257
PIC16F882/883/884/886/887
17.6
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Operating temperature
-40°C
T
A
+125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA
Thermal Resistance
Junction to Ambient
Junction to Ambient
47.2
C/W
40-pin PDIP package
24.4
C/W
44-pin QFN package
45.8
C/W
44-pin TQFP package
60.2
C/W
28-pin PDIP package
80.2
C/W
28-pin SOIC package
89.4
C/W
28-pin SSOP package
29
C/W
28-pin QFN package
TH02
JC
Thermal Resistance
Junction to Case
Junction to Case
24.7
C/W
40-pin PDIP package
20.0
C/W
44-pin QFN package
14.5
C/W
44-pin TQFP package
29
C/W
28-pin PDIP package
23.8
C/W
28-pin SOIC package
23.9
C/W
28-pin SSOP package
20.0
C/W
28-pin QFN package
TH03
T
J
Junction Temperature
150
C
For derated power calculations
TH04
PD
Power Dissipation
—
W
PD = P
INTERNAL
+ P
I
/
O
TH05
P
INTERNAL
Internal Power Dissipation
—
W
P
INTERNAL
= I
DD
x V
DD
(NOTE 1)
TH06
P
I
/
O
I/O Power Dissipation
—
W
P
I
/
O
=
(I
OL
* V
OL
) +
(I
OH
* (V
DD
-
V
OH
))
TH07
P
DER
Derated Power
—
W
P
DER
= (T
J
- T
A
)/
JA
(NOTE 2, 3)
Note 1: I
DD
is current to run the chip alone without driving any load on the output pins.
2: T
A
= Ambient Temperature.
3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DER
).